| |
Specification of Solder Paste
 Solder
alloy compositions
|
TIN
LEAD TYPE |
Tin (Sn) |
Lead (Pb) |
Silver (Ag) |
Melting Point ( ℃ ) |
|
Eutectic |
Solidus |
Liquidus |
|
B1 |
62 |
36 |
2 |
178 |
-- |
180 |
|
A1 |
63 |
37 |
-- |
183 |
-- |
184 |
Solder
composition follow the JIS Z3282 specification
|
LEAD-FREE TYPE |
Tin (Sn) |
Silver (Ag) |
Copper (Cu) |
Melting Point ( ℃ ) |
|
Eutectic |
Solidus |
Liquidus |
|
*
C1 |
96.5 |
3.5 |
-- |
221 |
-- |
222 |
|
D3 |
96.5 |
3.0 |
0.5 |
-- |
217 |
219 |
|
D5 |
95.5 |
3.8 |
0.7 |
-- |
217 |
219 |
|
D1 |
95.5 |
4.0 |
0.5 |
-- |
217 |
219 |
*
Patent
Free
Product Specifications
|
Specification Item |
SPECS |
|
B1 |
A1 |
D3 |
C1 |
D5 |
D1 |
|
Composition |
Sn62Pb36Ag2 |
Sn63Pb37 |
Sn96.5Ag3Cu0.5 |
Sn96.5Ag3.5 |
Sn95.5Ag3.8Cu0.7 |
Sn95.5Ag4Cu0.5 |
|
Paste Category |
No Clean |
|
Powder Size |
20-45 μm |
|
Color |
Light Grey |
|
Viscosity
(25,7.5rpm) |
40±5 ×104MPa |
|
Water Extract Resistivity (ohm.cm) |
>100,000 |
|
pH |
6 Typical |
|
Copper mirror test |
Passed |
|
Stencil Life |
6 months when stored at <10°C |
Available Packing
|
Container |
Qty |
|
Syringe |
1250 grams ; 1000 grams; 500 grams |
|
Jars |
500 grams |
Storage and Handling
|
Refrigerated storage of 0℃~10℃will
prolong the solder paste shelf life, to no less than 6 months. |
|
Syringes should be stored vertically with the dispensing
tip down. |
|
Solder paste should be allowed to reach ambient
temperature naturally, prior to use. (> 3 hours) |
|
Manual cleaning using 99% isopropyl alcohol (IPA), works
well. |
|
NEVER FREEZE SOLDER PASTE. |
|
