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3. Electro-Plating
BGA Solder Sphere
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Diameters |
Diameters Tolerance |
Spheroid Tolerance |
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0.76mm ( 30 mils) |
±0.015 mm (± 0.6mils) |
Within 1.5% |
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0.65mm ( 25 mils) |
±0.015 mm (± 0.6mils) |
Within 1.5% |
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0.60mm ( 24 mils) |
±0.010 mm (± 0.4mils) |
Within 1.5% |
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0.50mm ( 20 mils) |
±0.010 mm (± 0.4mils) |
Within 1.5% |
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0.45mm ( 18 mils) |
±0.010 mm (± 0.4mils) |
Within 1.5% |
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0.40mm ( 16 mils) |
±0.010 mm (± 0.4mils) |
Within 1.5% |
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0.35mm ( 14 mils) |
±0.010 mm (± 0.4mils) |
Within 1.5% |
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0.30mm ( 12 mils) |
±0.010 mm (± 0.4mils) |
Within 1.5% |
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0.25mm ( 10 mils) |
±0.010 mm (± 0.4mils) |
Within 1.5% |
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0.20mm ( 8 mils) |
±0.010 mm (± 0.4mils) |
Within 1.5% |
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0.15mm ( 6 mils) |
±0.005 mm (± 0.2mils) |
Within 1.5% |
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0.10mm ( 4 mils) |
±0.005 mm (± 0.2mils) |
Within 1.5% |
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0.075mm ( 3 mils) |
±0.005 mm (± 0.2mils) |
Within 1.5% |
Note: If your requirements is different from those specified in the
display, please informs us of the detail specification. We can usually
meet your requirements.
Available Packing
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Diameters |
Qty / Bottle |
Bottle / Inner Box |
Inner box / Carton |
Qty / Carton |
Carton Dimension |
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0.76mm ( 30 mils) |
250kpcs |
(A) 6 (C) 20 |
(A)10 (C) 1 |
(A) 15 kk pcs (C) 5 kk pcs |
(A) (C) |
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0.65mm ( 25 mils) |
250kpcs |
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0.60mm ( 24 mils) |
250kpcs |
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0.50mm ( 20 mils) |
500kpcs |
(A) 30 kk pcs (C) 10 kk pcs |
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0.45mm ( 18 mils) |
1,000kpcs |
(A) 60 kk pcs (C) 20 kk pcs |
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0.40mm ( 16 mils) |
1,000kpcs |
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0.35mm ( 14 mils) |
1,000kpcs |
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0.30mm ( 12 mils) |
1,000kpcs |
(A)10 (B)10 (C)35 |
(A)10 (B) 6 (C) 1 |
(A) 100 kk pcs (B) 60 kk pcs |
(A) (B) (C) |
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0.25mm ( 10 mils) |
1,000kpcs |
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0.20mm ( 8 mils) |
1,000kpcs |
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0.15mm ( 6 mils) |
1,000kpcs |
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0.10mm ( 4 mils) |
1,000kpcs |
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0.075mm ( 3 mils) |
1,000kpcs |
The packing quantities are available on your request.
Dimensions of Carton box :
(A) 395(W) x 300 (L) x 460(H) mm x 10 Case
(B) 395(W) x 300 (L) x 280(H) mm x 6 Case
(C) 395(W) x 275 (L) x 105(H) mm
※There is no inner box in the carton of (C) type.
Dimensions of Inner box :
280(W) x 185 (L) x 85(H) mm
Solder
spheres are packaged in ESD containers with a desiccant and fill in inert Nitrogen.
Storage and Handling
Clean and dry environments are required for solder spheres storage.
Probing of solder spheres in containers with fingers or other implements can damage the solder spheres by changing its shape, scoring its surface or contaminating its surface by skin oils. Shelf life of all solder spheres, stored in sealed ESD containers that are not agitated, is 1 year (12months).
Products
are stored in environment below
Temperature : 25 +/- 5 ℃
Humidity : <60 %RH
Reflow Profile
Recommend reflow profile is as below. In order to optimize the process
for your specific application, experimentation is recommended.
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TIN LEAD TYPE |
Tin Lead Assemble |
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Average Ramp Up Rate |
3 ℃/second max |
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Preheat Temperature |
100℃~ 150℃ |
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Preheat Time |
60~120 Seconds |
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Peak Temperature |
220℃~ 225℃ |
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Time within 5 ℃ of actual Peak temperature |
10~30 Seconds |
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Ramp Down Rate |
6 ℃/second max. |
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Time 25 ℃ to Peak Temperature |
6 minutes max |
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LEAD-FREE TYPE |
Lead-Free Assemble |
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Average Ramp Up Rate |
3 ℃/second max |
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Preheat Temperature |
150℃~200℃ |
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Preheat Time |
60~180 Seconds |
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Peak Temperature |
245℃~260℃ |
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Time within 5 ℃ of actual Peak temperature |
20~40 Seconds |
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Ramp Down Rate |
6 ℃/second max. |
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Time 25 ℃ to Peak Temperature |
8 minutes max |
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| © 2008 Profound Material |  |
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